Electronic Engineering McqsVLSI Design 100+ MCQ & Answer VLSI Design | page-08 | Electronic Engineering MCQ And Answer January 28, 2025 DSN MARATHI 71. Advantages of E-beam masks are A. small feature size B. larger feature size C. looser layer D. complex design Answer Option : D 72. Which process is used in E-beam machines? A. raster scanning B. vector scanning C. both of the mentioned D. none of the mentioned Answer Option : C 73. What is the feature of vector scanning? A. faster B. slow C. easy handling D. very simple design Answer Option : A 74. Which has high input resistance? A. nMOS B. CMOS C. pMOS D. BiCMOS Answer Option : B 75. BiCMOS has lower standby leakage current. A. true B. false Answer Option : B 76. Lithography is: A. Process used to transfer a pattern to a layer on the chip B. Process used to develop an oxidation layer on the chip C. Process used to develop a metal layer on the chip D. Process used to produce the chip Answer Option : A 77. Silicon oxide is patterned on a substrate using: A. Physical lithography B. Photolithography C. Chemical lithography D. Mechanical lithography Answer Option : B 78. The ______ is used to reduce the resistivity of poly silicon: A. Photo resist B. Etching C. Doping impurities D. None of the mentioned Answer Option : C 79. The isolated active areas are created by technique known as: A. Etched field-oxide isolation B. Local Oxidation of Silicon C. Both the mentioned D. None of the mentioned Answer Option : C 80. The chemical used for shielding the active areas to achieve selective oxide growth is: A. Silver Nitride B. Silicon Nitride C. Hydrofluoric acid D. Polysilicon Answer Option : B
71. Advantages of E-beam masks are A. small feature size B. larger feature size C. looser layer D. complex design Answer Option : D
72. Which process is used in E-beam machines? A. raster scanning B. vector scanning C. both of the mentioned D. none of the mentioned Answer Option : C
73. What is the feature of vector scanning? A. faster B. slow C. easy handling D. very simple design Answer Option : A
76. Lithography is: A. Process used to transfer a pattern to a layer on the chip B. Process used to develop an oxidation layer on the chip C. Process used to develop a metal layer on the chip D. Process used to produce the chip Answer Option : A
77. Silicon oxide is patterned on a substrate using: A. Physical lithography B. Photolithography C. Chemical lithography D. Mechanical lithography Answer Option : B
78. The ______ is used to reduce the resistivity of poly silicon: A. Photo resist B. Etching C. Doping impurities D. None of the mentioned Answer Option : C
79. The isolated active areas are created by technique known as: A. Etched field-oxide isolation B. Local Oxidation of Silicon C. Both the mentioned D. None of the mentioned Answer Option : C
80. The chemical used for shielding the active areas to achieve selective oxide growth is: A. Silver Nitride B. Silicon Nitride C. Hydrofluoric acid D. Polysilicon Answer Option : B
